OFC 2024 | ficonTEC：開啟集成光子學(xué)新篇章，引領(lǐng)未來需求新浪潮

        ICC訊  2024年3月在美國圣地亞哥舉辦的光纖通訊展覽會(huì)創(chuàng)下了參展商與觀展人數(shù)新紀(jì)錄，這標(biāo)志著在AI技術(shù)迅猛發(fā)展一年之后，光通訊和網(wǎng)絡(luò)產(chǎn)業(yè)迎來了繁榮和飛速進(jìn)步的新篇章。

        OFC 2024 celebrates unprecedented visitor and exhibitor numbers and spotlights a thriving and rapidly evolving optical communications and networking industry following a year of intensive AI development

        通過OFC展，我們見證了一場(chǎng)充滿活力且鼓舞人心的技術(shù)展示，再次確認(rèn)了OFC作為全球光通訊和網(wǎng)絡(luò)行業(yè)首屈一指的活動(dòng)地位。相比2023年，本屆展會(huì)參展商數(shù)量同比增長近四分之一，吸引了約12500名國際觀眾。展會(huì)的焦點(diǎn)議題涵蓋了800ZR、相干PON、線性可插拔光學(xué)（LPO）、多芯光纖、人工智能（AI）、數(shù)據(jù)中心技術(shù)和量子網(wǎng)絡(luò)等。

        At a very well visited and highly inspiring technology showcase display, OFC 2024 has again solidified the OFC conference’s status as the premier global event for optical networking and communications. With exhibitor numbers up almost a quarter year-on-year and some 12,500 international registered visitors, the most significant focus topics included 800ZR, Coherent PON, Linear Pluggable Optics (LPO), multicore fiber, artificial intelligence (AI), data center technology and quantum networking.

        基于集成光子學(xué)和相關(guān)PIC器件（例如可插拔的CPO共封裝光學(xué)器件）應(yīng)用的光學(xué)互聯(lián)技術(shù)，已經(jīng)成為行業(yè)重要的技術(shù)基石之一—ficonTEC也已在其技術(shù)路徑上部署了高效的生產(chǎn)設(shè)備。然而，由于大規(guī)模生成式人工智能網(wǎng)絡(luò)的需求對(duì)市場(chǎng)的直接影響，集成光子學(xué)的作用也正在經(jīng)歷一個(gè)關(guān)鍵的優(yōu)先級(jí)變化。也就是說，隨著市場(chǎng)對(duì)數(shù)據(jù)中心架構(gòu)組件的需求日益激增，硬件的更新迭代速度也在不斷加快。

        Optical interconnects based on the utilization of integrated photonics and the associated PIC devices (e.g. in the form of co-packaged optics (CPO) for pluggables) already represent a vital technology cornerstone – a technology approach for which ficonTEC already has active production systems in the field. However, as a direct consequence of a marketplace now propelled by large-scale generative AI network demand, the role of integrated photonics is now undergoing a pivotal change in priority – that is, the surge in interest for the various components that make up data center architecture is also accompanied by an acceleration in the pace of hardware updates.

        為了應(yīng)對(duì)這一挑戰(zhàn)，關(guān)鍵在于推進(jìn)集成光子技術(shù)的規(guī)?；约疤岣吲可a(chǎn)能力。而這一點(diǎn)目前還尚未得到充分重視，亟需行業(yè)內(nèi)眾多伙伴的緊密協(xié)作，共同實(shí)現(xiàn)未來光通訊領(lǐng)域原材料、組件、模塊和子系統(tǒng)生產(chǎn)的降本增效。

        One significant task in catering to this demand will be the scaling of integrated photonics technologies and so too their high-volume manufacturing. This is perhaps currently an underestimated challenge and one that will require close co-operation among multiple partners in the industry to enable the cost-effective manufacturing of materials, components, modules and subsystems for future optical communications.

        為了更生動(dòng)展示行業(yè)內(nèi)直接合作帶來的優(yōu)勢(shì)，ficonTEC在OFC 2024的展臺(tái)上還進(jìn)行了現(xiàn)場(chǎng)演示。并通過和光子封裝和工藝開發(fā)領(lǐng)域領(lǐng)導(dǎo)者Silitronics Solutions, Inc.（主營業(yè)務(wù)為光子OSAT即外包半導(dǎo)體封裝和測(cè)試）的現(xiàn)場(chǎng)合作，生動(dòng)展示了真實(shí)環(huán)境下的封裝流程。

        To showcase the benefits resulting from direct collaboration within the ecosystem, ficonTEC hosted live demos on its booth at OFC 2024. In one example, real-world assembly processes were demonstrated in partnership with Silitronics Solutions, Inc., the leader in photonic packaging and process development as a photonic OSAT (outsourced semi-conductor assembly and test).

        Silitronics也充分發(fā)揮了ficonTEC制造系統(tǒng)的多項(xiàng)核心競(jìng)爭(zhēng)力和差異化優(yōu)勢(shì)。這些優(yōu)勢(shì)源于ficonTEC強(qiáng)大的研發(fā)實(shí)力及其對(duì)制造流程的深刻理解，其中包括可選的基于ML（機(jī)器學(xué)習(xí)）的流程優(yōu)化工具（ficonEDGE）以及通過虛擬機(jī)概念提供培訓(xùn)和“軟開發(fā)”機(jī)會(huì)。借助這些工具，在進(jìn)行協(xié)同開發(fā)后，初始概念驗(yàn)證原型的周期時(shí)間已從20周減少到4周。此外，通過全面的全球化支持、培訓(xùn)項(xiàng)目以及機(jī)器重新配置和重新定位選項(xiàng)所帶來的靈活性和“工業(yè)準(zhǔn)備”能力，使這些優(yōu)勢(shì)在后期的流程中得到了進(jìn)一步體現(xiàn)，從而滿足不斷變化的市場(chǎng)需求和產(chǎn)品迭代。

        Silitronics makes use of several competitive differentiators provided by ficonTEC manufacturing systems. The advantages begin with ficonTEC’s unparalleled R&D and experience-driven understanding of manufacturing processes, includes optional ML-based tools for process optimization (ficonEDGE), and provides training and ‘soft development’ opportunities via a virtual machine concept. Using these tools, and after performing collaborative co-development, the cycle time for initial proof-of-concept prototypes has been reduced from 20 to 4 weeks. Moreover, the advantages continue later in one’s own process with comprehensive global support, training programs, and the flexibility and ‘industrial readiness’ provided by machine re-configuration and re-purposing options in order to address evolving market demands and product iterations.

        與此同時(shí)，Quantifi Photonics還在展會(huì)上展示了一系列互補(bǔ)的光子測(cè)試解決方案，強(qiáng)調(diào)了“為測(cè)試而設(shè)計(jì)”的重要性。這些解決方案包括了激光源、偏振控制器、光功率計(jì)和光譜分析儀等設(shè)備，它們都是通過精心設(shè)計(jì)以便能夠無縫集成到光電子產(chǎn)品的裝配和包裝平臺(tái)。

        At the same time, the importance of ‘design-for-test’ was also highlighted on the booth with a range of complementary photonic test solutions exhibited by Quantifi Photonics. This display included laser sources, polarization controllers, optical power meters and optical spectrum analyzers that are all designed to be integrated into assembly and packaging platforms.

        展會(huì)上，多家企業(yè)的聯(lián)合展示也反映出了光通訊制造技術(shù)在未來實(shí)際生產(chǎn)中的一些重要要素。首先，隨著集成光子學(xué)在行業(yè)內(nèi)和其他領(lǐng)域的地位日益凸顯，確保組裝、測(cè)試和封裝設(shè)備的可重復(fù)使用性成為其保持行業(yè)先進(jìn)制造能力的關(guān)鍵要求。與此同時(shí)，例如由Silitronics封裝解決方案提供的OSAT和合同生產(chǎn)（CM）服務(wù)，也展現(xiàn)了在極短的時(shí)間內(nèi)以低成本、高效益模式進(jìn)行全自動(dòng)批量生產(chǎn)的能力。最后，Quantify Photonics的測(cè)試解決方案解決了在晶圓和/或芯片級(jí)別對(duì)DUT（被測(cè)試設(shè)備）進(jìn)行測(cè)試的迫切需求，確保在批量生產(chǎn)環(huán)境中光子器件能夠全面滿足規(guī)格要求。該解決方案不但提升了成本效益和測(cè)試產(chǎn)量，并支持平行測(cè)試，從而優(yōu)化測(cè)試流程。

        This type of joint presence at OFC captures some of the all-important aspects of actually manufacturing the optical communication technology of the future. Firstly, in acknowledging the growing role of integrated photonics in this and other sectors, it is clear that assembly, test and packaging equipment must remain reusable in order to retain manufacturing capacity within the respective ecosystems. At the same time, OSAT and contract manufacturing (CM) services provided e.g. by Silitronics’ packaging solutions demonstrate the ability to manufacture flexibly in a fully automated fashion and cost-effectively in high volumes in record times. Finally, Quantifi Photonics’ test solutions address the critical requirement of testing the DUT at the wafer and/or die level, and fully characterizing the photonic devices in volume manufacturing environments to make sure that they meet specifications. The focus is cost-effectiveness and test throughput, and also enabling an optimized test flow with parallel testing where possible.

        OFC展會(huì)落幕之際，ficonTEC、Silitronics、Quantifi Photonics還與多家行業(yè)伙伴包括Global Foundries、Nvidia、Broadcom和Jabil等，共同參加了一場(chǎng)開放性的圓桌討論。討論重點(diǎn)是如何在擴(kuò)大PIC（光集成電路）技術(shù)生產(chǎn)規(guī)模的同時(shí)，保持生產(chǎn)效率和產(chǎn)品質(zhì)量的領(lǐng)先水平，并分享了提升產(chǎn)量、優(yōu)化定價(jià)策略、縮短生產(chǎn)周期以及保證產(chǎn)品可靠性等方面的經(jīng)驗(yàn)和見解。

        To round out OFC week, ficonTEC, Silitronics and Quantifi Photonics all joined an open panel discussion with other ecosystem companies – including Global Foundries, Nvidia, Broadcom and Jabil – to provide a broader perspective on how to scale PIC technologies for high-volume production with the best yield, pricing, cycle time and quality.

        關(guān)于ficonTEC

        ficonTEC是公認(rèn)的高端光電子元件和集成光子器件自動(dòng)化封裝和測(cè)試設(shè)備領(lǐng)域的市場(chǎng)引領(lǐng)者。20多年來，ficonTEC積累了大量的工藝能力和獨(dú)有的封裝技術(shù)，可以滿足電信/數(shù)據(jù)通信/5G、高功率二極管激光組裝、從生物醫(yī)學(xué)到汽車激光雷達(dá)的物聯(lián)網(wǎng)傳感器設(shè)備、微光學(xué)模塊、光纖等行業(yè)細(xì)分市場(chǎng)的廣泛需求。ficonTEC靈活且可擴(kuò)展的自動(dòng)化方案，可適用于早期產(chǎn)品開發(fā)、新產(chǎn)品導(dǎo)入一直到大批量制造（無論是委約生產(chǎn)還是內(nèi)部研發(fā)和生產(chǎn)）的定制封裝和測(cè)試解決方案。

        ficonTEC is the recognized market leader for automated assembly and testing machine systems for high-end opto-electronic components and integrated photonic devices. Considerable process capability and dedicated assembly technologies have been accumulated over more than two decades of serving the needs of a broad selection of industry segments – including telecom/datacom/5G, high-power diode laser assembly, IoT-conform sensor devices from bio-med to automotive lidar, micro-optical modules, fiber-optics and more. ficonTEC’s flexible and scalable automation options enable customized assembly and test solutions suitable for early device development, for new product introduction (NPI), and all the way up to high-volume manufacturing (HVM) – regardless of whether for contract manufacturing or for in-house R&D and production.