ICC訊 全球TOP8光模塊制造商華工正源發(fā)布預(yù)告,在3月26日美國OFC光纖通信展上,將攜“新”出擊,圍繞下一代數(shù)據(jù)中心建設(shè)、陸??仗煲惑w化主題,向全球合作伙伴展示在ChatGPT4.0、Sora、5G-A等應(yīng)用場景下,最新高速率光模塊產(chǎn)品進展。
HGGenuine, a global TOP8 optical module manufacturer, will launch a "new" campaign at the OFC2024 in the US on March 26th, showcasing the latest progress in high-speed optical module products in application scenarios such as ChatGPT4.0, Sora, and 5G-A to global partners around the theme of next-generation data center construction.
硬實力
POWERFUL
1.6T/200G per lane
為滿足Sora、ChatGPT等AI應(yīng)用端需求,華工正源在現(xiàn)有400G和800G成功硅光產(chǎn)品研發(fā)基礎(chǔ)上,將推出基于單波200G 的1.6T各類模塊產(chǎn)品,該1.6T模塊產(chǎn)品采用自研單波200G硅光芯片,并兼容薄膜鈮酸鋰調(diào)制器。
To meet the ever-increasing needs of AI applications such as Sora and ChatGPT, HGGenuine will launch a portfolio of 200G/lane 1.6T module products which use 200G/lane silicon photonic chips developed in-house, and can also accommodate TFLN modulators.
800G LPO Series
AI時代,算力為王。AI大模型的快速迭代,對數(shù)據(jù)中心網(wǎng)絡(luò)架構(gòu)提出了更高要求,推動其向低時延、高速率、低功耗方向快速演進。從應(yīng)用市場來看,高速率光模塊帶來的降本降耗推動硅光、NPO、CPO等技術(shù)發(fā)展。在OFC2024現(xiàn)場,華工正源即將Live Demo的800G LPO SiPh,采用自研高線性硅光芯片方案作為核心技術(shù),功耗低至8~10W。
At the OFC2024 site, 800G DR8 LPO module based on SiPh technology is demostrated, which adopts a self-developed silicon photonics chip with high linearity as the core technology, with a power consumption as low as 8-10W.
高人氣
GATHERING
800G ZR/ZR+
華工正源將推出應(yīng)用于DCI領(lǐng)域長距離傳輸?shù)?00G QSFP-DD ZR/ZR+相干光模塊,核心指標(biāo)均高于行業(yè)規(guī)格,且余量充足。在OFC2024現(xiàn)場,華工正源將全球首款動態(tài)DEMO的800G ZR??捎行崿F(xiàn)DCI光層在不安裝中繼放大器場景下,實現(xiàn)超遠距離傳輸。
HGGenuine will launch an 800G QSFP-DD ZR/ZR+ coherent optical transceiver for long distance transmission in the DCI field, with excellent product performance, higher-than-industry parameters and sufficient margin. and can directly transmit 120KM point-to-point without an external optical amplifier.
從800G到1.6T;
從東半球到西半球,
這一次,我們尖子生集結(jié)。
光網(wǎng)絡(luò)架構(gòu)下的多維方案;
華工正源邀您蒞臨共鑒。